Sn plating solution

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Sn plating solution

Sn plating solution

FM has been developing plating solutions and the related process techniques to improve quality issues after plating in MLCC and the other chip parts.

- surface density (coverage) and spattering during reflow
- thickness and its variation
- plating stress and crack
- reaction (etching) with glass on termination layer
- detail plating process for improving reliability and productivity

  (a) in ref. plating solution (b) in FM plating solution (TSM-2)

< Comparison of glass dissolution from Cu-terminated MLCC in (a) ref. plating solution, and (b) FM plating solution (TSM-2)

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