Generally, soft termination was formed on sintered-Cu terminated MLCC, on which Ni and Sn layers are plated. If Sn is plated directly on the surface of soft termination without Ni plating, then some problems, such as whisker or low adhesion, may happen. FM has been developed Ni-epoxy paste for soft termination of MLCC. Sn can be plated directly on Ni-epoxy surface. By deleting Ni plating process, MLCC makers can produce soft termination MLCC with low cost and make better reliability by removing some defects due to Ni plating.
|However, it is difficult to get good plating quality on Ni-epoxy because Ni has lower conductivity than Ag or Cu. So peeling of Sn plating layer or low ESR problems may happen. FM has developed Ni-epoxy material and the related techniques to overcome those problems.|